HiTEN - the international conference on high temperature electronics

HiTEN - the international conference on high temperature electronics is taking place in Oxford, UK on 13-16th September 2009.  HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.
 
Abstracts are being requested in the following areas:

• Applications in the Aerospace, Automotive, Oil & Gas, and Geothermal Industries
• Devices and applications
• Novel devices
• ASICs for high temperature applications
• Memories
• Passive components
• Power devices
• Semiconductor materials
• Contacts and metallizations
• Materials
• Packaging and inter connects
• Sealants, adhesives, solders
• Reliability and failure mechanisms
• Lifetime predictions
• Accelerated life testing
• Testing at high temperatures

Those wishing to present a paper at the HiTEN Conference must submit a 200-300 word abstract electronically no later May 15, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. A Final Manuscript of 6-12 pages, two-column format is due July 24, 2009, for all accepted abstract.

See www.imaps.org/callfor/hiten2009.htm for more details.